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W9725G6KB-3I - Winbond

Description: 256Mb DDR2 SDRAM 667MHz WBGA84

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Symbol

W9725G6KB-3I - Winbond - PCB symbol

PCB Footprints

W9725G6KB-3I - Winbond PCB footprint - BGA - BGA - WBGA-84 (8x12.5 mm2, ball pitch: 0.8mm, Ø =0.45mm)

3D Models

W9725G6KB-3I - Winbond - 3D model - BGA - WBGA-84 (8x12.5 mm2, ball pitch: 0.8mm, Ø =0.45mm)

Datasheet Download Datasheet
Stock & Prices Price & Stock for W9725G6KB-3I
Part Number W9725G6KB-3I
Manufacturer Winbond
Pin Count 84
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - WBGA-84 (8x12.5 mm2, ball pitch: 0.8mm, Ø =0.45mm)
Released Date Aug 4, 2024
Last Modified Date Aug 4, 2024 1:58 PM UTC
Pinout / Pin List Click Here (Member Only)

W9725G6KB-3I Details

Manufacturer Part Number:
W9725G6KB-3I
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Date Of Intro:
2018-07-04
Manufacturer:
Winbond Electronics Corp
YTEOL:
4
Memory IC Type:
DDR2 DRAM
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED

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