W9725G8KB-25 - Winbond

W9725G8KB-25 Details

• Manufacturer Part Number:

  W9725G8KB-25

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  WBGA-60

• Pin Count:

  60

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.24

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  4

• Access Mode:

  FOUR BANK PAGE BURST

• Access Time-Max:

  0.4 ns

• Additional Feature:

  AUTO/SELF REFRESH

• Clock Frequency-Max (fCLK):

  400 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B60

• Length:

  12.5 mm

• Memory Density:

  268435456 bit

• Memory IC Type:

  DDR2 DRAM

• Memory Width:

  8

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  60

• Number of Words:

  33554432 words

• Number of Words Code:

  32000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Organization:

  32MX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA60,9X12,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.045 A

• Supply Current-Max:

  0.15 mA

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  8 mm