W972GG6JB25I - Winbond

W972GG6JB25I Details

• Manufacturer Part Number:

  W972GG6JB25I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TFBGA, BGA84,9X15,32

• Reach Compliance Code:

  Compliant

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  0

• Access Mode:

  MULTI BANK PAGE BURST

• Access Time-Max:

  0.4 ns

• Additional Feature:

  AUTO/SELF REFRESH

• Clock Frequency-Max (fCLK):

  400 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B84

• Length:

  13 mm

• Memory Density:

  2147483648 bit

• Memory IC Type:

  DDR2 DRAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  84

• Number of Words:

  134217728 words

• Number of Words Code:

  128000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  95 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128MX16

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA84,9X15,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Qualification Status:

  Not Qualified

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.012 A

• Supply Current-Max:

  0.25 mA

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  11 mm