W978H6KBVX2I - Winbond

W978H6KBVX2I Details

• Manufacturer Part Number:

  W978H6KBVX2I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  VFBGA-134

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.24

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  3

• Access Mode:

  FOUR BANK PAGE BURST

• Additional Feature:

  AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM

• JESD-30 Code:

  R-PBGA-B134

• Length:

  11.5 mm

• Memory Density:

  268435456 bit

• Memory IC Type:

  LPDDR2 DRAM

• Memory Width:

  16

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  134

• Number of Words:

  16777216 words

• Number of Words Code:

  16000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  16MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Seated Height-Max:

  1 mm

• Self Refresh:

  YES

• Supply Voltage-Max (Vsup):

  1.3 V

• Supply Voltage-Min (Vsup):

  1.14 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  10 mm