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W9816G6JH-6I - Winbond

Description: SDRAM 166MHz TSOPII50

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W9816G6JH-6I - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - TSOP (TYPE II) 50L 400 mil
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3D Models
W9816G6JH-6I - Winbond  - 3D model - Small Outline Packages - TSOP (TYPE II) 50L 400 mil
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W9816G6JH-6I Details

  • Manufacturer Part Number:

    W9816G6JH-6I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TSOP2-50

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.02

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    3

  • Access Mode:

    DUAL BANK PAGE BURST

  • Access Time-Max:

    5 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    R-PDSO-G50

  • Length:

    20.95 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    50

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10.16 mm

W9816G6JH-6I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the W9816G6JH-6I is -40°C to 85°C.
  • The power-up sequence for the W9816G6JH-6I is critical. You should power up the VCCQ pin first, followed by the VCC pin. This ensures proper initialization of the chip.
  • For optimal performance, it is recommended to follow a 4-layer PCB stack-up with a solid ground plane on the bottom layer, and to keep the signal traces as short as possible.
  • To troubleshoot issues with the W9816G6JH-6I, start by checking the power supply voltage levels, then verify the clock signal integrity, and finally, use a logic analyzer to debug the data signals.
  • Yes, the W9816G6JH-6I is a sensitive device and requires proper ESD protection during handling and assembly. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded.

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W9816G6JH-6I Overview

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