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WLAN8101H - NXP

Description: QFN MODULE

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PCB Footprints
WLAN8101H - NXP PCB footprint - Other - Other - SOT2022-1
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3D Models
WLAN8101H - NXP  - 3D model - Other - SOT2022-1
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WLAN8101H Details

  • Manufacturer Part Number:

    WLAN8101H

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HFCPLGA-38

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2020-08-17

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    R-XLGA-N38

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HLGA

  • Package Equivalence Code:

    LGA38(UNSPEC)

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Seated Height-Max:

    0.685 mm

  • Supply Voltage-Nom:

    3.85 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    BOTTOM

  • Width:

    3 mm

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WLAN8101H Overview

Use the download button to access the WLAN8101H schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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