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XA6SLX45-3CSG324Q - AMD

Description: PROGRAMMABLE LOGIC IC, FPGA

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PCB Footprints
XA6SLX45-3CSG324Q - AMD PCB footprint - BGA - BGA - CSG324
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XA6SLX45-3CSG324Q - AMD  - 3D model - BGA - CSG324
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XA6SLX45-3CSG324Q Details

  • Manufacturer Part Number:

    XA6SLX45-3CSG324Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    7.3

  • Clock Frequency-Max:

    62.5 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    218

  • Number of Logic Cells:

    43661

  • Number of Outputs:

    218

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3411 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    45 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XA6SLX45-3CSG324Q Frequently Asked Questions (FAQs)

  • The XA6SLX45-3CSG324Q has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • The XA6SLX45-3CSG324Q has a dedicated DDR3 memory controller, and you can use the Memory Interface Generator (MIG) tool in Vivado Design Suite to implement the DDR3 interface. You'll need to follow the MIG user guide and the FPGA's datasheet for specific implementation details.
  • The XA6SLX45-3CSG324Q has a maximum clock frequency of 500 MHz, but the actual frequency depends on the specific design, clocking architecture, and implementation. You should consult the FPGA's datasheet and the Vivado Design Suite documentation for more information.
  • Yes, the XA6SLX45-3CSG324Q has built-in support for high-speed serial interfaces like PCIe Gen2 and SATA II. You can use the FPGA's integrated transceivers and the Vivado Design Suite's IP integrator to implement these interfaces.
  • To optimize power consumption, you can use the Vivado Design Suite's power analysis and optimization tools, such as the Power Analyzer and the Power Optimization Wizard. You should also consider using power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).

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XA6SLX45-3CSG324Q Overview

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