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XA7A15T-1CPG236Q - AMD

Description: FPGA - Field Programmable Gate Array XA7A15T-1CPG236Q

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XA7A15T-1CPG236Q - AMD PCB footprint - BGA - BGA - CP236 and CPG236 (Artix-7 FPGAs) Wire-Bond Chip-Scale BGA (0.5 mm Pitch)
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XA7A15T-1CPG236Q Details

  • Manufacturer Part Number:

    XA7A15T-1CPG236Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-236

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    9

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B236

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1300

  • Number of Inputs:

    210

  • Number of Logic Cells:

    16640

  • Number of Outputs:

    210

  • Number of Terminals:

    236

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1300 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

XA7A15T-1CPG236Q Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the XA7A15T-1CPG236Q, which includes recommendations for PCB layout, thermal design, and heat sink attachment. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • The XA7A15T-1CPG236Q has a complex clocking architecture. AMD provides a Clock Wizard tool that helps configure the clocking and PLL settings for specific applications. Additionally, the device's technical reference manual and user guides provide detailed information on clocking and PLL configuration.
  • The XA7A15T-1CPG236Q has a dynamic power management system that allows for power gating, clock gating, and voltage scaling. AMD provides power consumption estimates and guidelines for power management in the device's datasheet and technical reference manual. Engineers can also use the Xilinx Power Estimator (XPE) tool to estimate power consumption for their specific design.
  • The XA7A15T-1CPG236Q has a complex boot process that involves loading firmware from external memory. AMD provides a boot loader and firmware loading guidelines in the device's technical reference manual and user guides. Engineers can also use the Xilinx Vivado Design Suite to implement and verify the boot process.
  • AMD offers various development boards and kits for the XA7A15T-1CPG236Q, such as the Xilinx Zynq-7000 SoC ZC702 Evaluation Kit and the Xilinx Zynq-7000 SoC ZC706 Evaluation Kit. These kits provide a comprehensive development environment, including hardware, software, and documentation. Engineers can also use third-party development boards and kits that are compatible with the XA7A15T-1CPG236Q.

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XA7A15T-1CPG236Q Overview

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Part Image XA7A15T-1CPG236Q AMD Xilinx

Field Programmable Gate Array, 1300 CLBs, 1098MHz, 16640-Cell, HKMG, PBGA236