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XA7A15T-1CSG324Q - AMD

Description: Automotive, AEC-Q100, Artix-7 XA Field Programmable Gate Array (FPGA) IC 210 921600 16640 324-LFBGA, CSPBGA

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PCB Footprints
XA7A15T-1CSG324Q - AMD PCB footprint - BGA - BGA - CSG324
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XA7A15T-1CSG324Q - AMD  - 3D model - BGA - CSG324
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XA7A15T-1CSG324Q Details

  • Manufacturer Part Number:

    XA7A15T-1CSG324Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    9

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1300

  • Number of Inputs:

    210

  • Number of Logic Cells:

    16640

  • Number of Outputs:

    210

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1300 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XA7A15T-1CSG324Q Frequently Asked Questions (FAQs)

  • The XA7A15T-1CSG324Q has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • The XA7A15T-1CSG324Q has a dedicated DDR3 memory controller, and AMD provides a DDR3 memory interface IP core that can be used to implement the interface. Additionally, the Xilinx Vivado Design Suite provides tools and resources to help with the implementation.
  • The XA7A15T-1CSG324Q has a maximum clock frequency of 350 MHz, making it suitable for high-speed applications.
  • Yes, the XA7A15T-1CSG324Q is designed for high-reliability applications, with features such as single-event upset (SEU) mitigation, error correction, and built-in self-test (BIST) capabilities.
  • The XA7A15T-1CSG324Q can be programmed and configured using the Xilinx Vivado Design Suite, which provides a comprehensive development environment for designing, implementing, and testing FPGA-based systems.

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XA7A15T-1CSG324Q Overview

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Part Image XA7A15T-1CSG324I AMD

Field Programmable Gate Array, 1300 CLBs, 1098MHz, 16640-Cell, HKMG, PBGA324

Part Image XA7A15T-1CSG324Q AMD Xilinx

Field Programmable Gate Array, 1300 CLBs, 16640-Cell, HKMG, PBGA324