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XAM6254ATCGGAALW - Texas Instruments

Description: ARM® Cortex®-A53 Microprocessor IC Sitara™ 4 Core, 64-Bit 1.4GHz 425-FCCSP (13x13)

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PCB Footprints
XAM6254ATCGGAALW - Texas Instruments PCB footprint - BGA - BGA - ALW0425A
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XAM6254ATCGGAALW - Texas Instruments  - 3D model - BGA - ALW0425A
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XAM6254ATCGGAALW Details

  • Manufacturer Part Number:

    XAM6254ATCGGAALW

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FCCSP-425

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    also available with 0.75V Nom suppl

  • JESD-30 Code:

    S-PBGA-B425

  • Length:

    13 mm

  • Number of Terminals:

    425

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA425,25X25,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.89 mm

  • Supply Voltage-Max:

    0.895 V

  • Supply Voltage-Min:

    0.81 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

XAM6254ATCGGAALW Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the XAM6254ATCGGAALW datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using decoupling capacitors to reduce noise and ensure signal integrity.
  • The XAM6254ATCGGAALW has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the thermal design guidelines in the datasheet and application notes.
  • The recommended power-up sequence for the XAM6254ATCGGAALW is to power up the VDDIO and VDDA pins simultaneously, followed by the VDD pin. This ensures proper device initialization and prevents latch-up or other issues.
  • To minimize power consumption, configure the XAM6254ATCGGAALW to use the lowest possible clock frequency, disable unused peripherals, and use the power-down modes (e.g., sleep mode) when the device is not in use. Refer to the datasheet and application notes for specific power-saving techniques.
  • To minimize electromagnetic interference (EMI) and radio-frequency interference (RFI), use proper shielding, grounding, and decoupling techniques. Ensure that the PCB layout is designed to minimize radiation and that the device is placed in a shielded enclosure if necessary. Follow the EMI and RFI guidelines in the datasheet and application notes.

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XAM6254ATCGGAALW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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