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XC3S1400A-4FTG256I - AMD

Description: FPGA - Field Programmable Gate Array XC3S1400A-4FTG256I

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XC3S1400A-4FTG256I Details

  • Manufacturer Part Number:

    XC3S1400A-4FTG256I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2816

  • Number of Equivalent Gates:

    1400000

  • Number of Inputs:

    161

  • Number of Logic Cells:

    25344

  • Number of Outputs:

    148

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2816 CLBS, 1400000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S1400A-4FTG256I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S1400A-4FTG256I is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S1400A. The guide provides guidelines for synchronizing data between clock domains and minimizing metastability.
  • The power consumption of XC3S1400A-4FTG256I depends on the specific application and usage. However, Xilinx provides a power estimator tool that can help estimate the power consumption based on the design requirements. Typically, the power consumption of this FPGA ranges from 1-5 watts.
  • Yes, the XC3S1400A-4FTG256I is suitable for high-reliability applications. It is designed to meet the requirements of aerospace, defense, and industrial applications, and is available in a variety of grades, including QML-V (Qualified Manufacturers List - Class V) and ESCC (European Space Components Coordination) qualified.
  • Xilinx provides a range of tools and methodologies for debugging and testing FPGA designs, including ChipScope, SignalTap, and Vivado Logic Analyzer. These tools allow designers to observe and analyze the internal signals of the FPGA, identify errors, and optimize their design.

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XC3S1400A-4FTG256I Overview

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Image Part Number Model
Part Image XC3S1400A-4FTG256C AMD Xilinx

Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA256

Part Image XC3S1400A-4FTG256I AMD Xilinx

Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA256

Part Image XC3S1400A-4FT256I AMD Xilinx

Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA256

Part Image XC3S1400A-4FT256C AMD Xilinx

Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA256

Part Image XC3S1400A-4FT256C AMD

Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA256

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