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XC3S200A-4FTG256C - AMD

Description: Xilinx FPGA XC3S200A-4FTG256C, Spartan-3A 4032 Cells, 200000 Gates, 28672bit, 4032 Blocks, 256-Pin FTBGA

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XC3S200A-4FTG256C Details

  • Manufacturer Part Number:

    XC3S200A-4FTG256C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    448

  • Number of Equivalent Gates:

    200000

  • Number of Inputs:

    195

  • Number of Logic Cells:

    4032

  • Number of Outputs:

    160

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    448 CLBS, 200000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S200A-4FTG256C Frequently Asked Questions (FAQs)

  • The XC3S200A-4FTG256C has an operating temperature range of -40°C to 100°C (industrial grade) and 0°C to 85°C (commercial grade).
  • To implement a CDC in the XC3S200A-4FTG256C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the XC3S200A-4FTG256C depends on the design complexity and the clocking architecture. However, the FPGA can support clock frequencies up to 350 MHz.
  • To optimize power consumption, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, optimize your design for minimal switching activity and use low-power modes when possible.
  • The XC3S200A-4FTG256C can be configured using a variety of methods, including JTAG, SPI, and BPI. The FPGA also supports partial reconfiguration and remote update capabilities.

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XC3S200A-4FTG256C Overview

Use the download button to access the XC3S200A-4FTG256C 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC3S2, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XC3S200A-4FTG256C AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XA3S200A-4FTG256Q AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200A-4FT256I AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200A-4FT256C AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XA3S200A-4FTG256I AMD

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

For a full list of alternate parts for XC3S200A-4FTG256C, check out Findchips.com