Part Image

XC3S200AN-4FT256I - AMD

Description: FPGA - Field Programmable Gate Array Connect EBOM

Download XC3S200AN-4FT256I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XC3S200AN-4FT256I - AMD PCB footprint - BGA - BGA - FT256/FTG256
click to zoom
3D Models
XC3S200AN-4FT256I - AMD  - 3D model - BGA - FT256/FTG256
click to zoom

XC3S200AN-4FT256I Details

  • Manufacturer Part Number:

    XC3S200AN-4FT256I

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    448

  • Number of Equivalent Gates:

    200000

  • Number of Inputs:

    195

  • Number of Logic Cells:

    4032

  • Number of Outputs:

    160

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    448 CLBS, 200000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S200AN-4FT256I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S200AN-4FT256I is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S200AN. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC3S200AN-4FT256I depends on the operating frequency, voltage, and usage. According to the datasheet, the typical power consumption is around 1.2W at 50MHz and 1.5V. However, this value can vary depending on the specific design and usage.
  • The XC3S200AN-4FT256I is a Spartan-3A FPGA, which is not designed for high-speed interfaces like PCIe or SATA. It has a maximum clock frequency of 200MHz, which is not sufficient for these high-speed interfaces. For high-speed interfaces, you may need to consider a higher-end FPGA like the Virtex series.
  • Xilinx provides a range of tools for programming and debugging their FPGAs, including the XC3S200AN. These tools include the Xilinx ISE Design Suite, Vivado Design Suite, and ChipScope Pro. You can use these tools to program the FPGA, debug your design, and perform timing analysis.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XC3S200AN-4FT256I Overview

Use the download button to access the XC3S200AN-4FT256I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XC3S2, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to XC3S200AN-4FT256I

Showing 0 results

XC3S200AN-4FT256I Alternates

Showing results

Image Part Number Model
Part Image XC3S200AN-4FTG256I AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200AN-4FTG256C AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200AN-4FT256I AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200A-4FT256I AMD Xilinx

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

Part Image XC3S200AN-4FTG256I AMD

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, 4032-Cell, CMOS, PBGA256

For a full list of alternate parts for XC3S200AN-4FT256I, check out Findchips.com