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XC3S250E-4FT256C - AMD

Description: FPGA - Field Programmable Gate Array XC3S250E-4FT256C

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XC3S250E-4FT256C - AMD PCB footprint - BGA - BGA - FT256/FTG256
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XC3S250E-4FT256C - AMD  - 3D model - BGA - FT256/FTG256
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XC3S250E-4FT256C Details

  • Manufacturer Part Number:

    XC3S250E-4FT256C

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    572 MHz

  • Combinatorial Delay of a CLB-Max:

    0.76 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    612

  • Number of Equivalent Gates:

    250000

  • Number of Inputs:

    172

  • Number of Logic Cells:

    5508

  • Number of Outputs:

    132

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    612 CLBS, 250000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S250E-4FT256C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC3S250E-4FT256C is 350 MHz, but it depends on the specific application and design implementation.
  • To implement a CDC in the XC3S250E-4FT256C, you can use synchronous or asynchronous FIFOs, or use a clock domain crossing circuit. The Xilinx Clocking Wizard tool can also help with CDC implementation.
  • The power consumption of the XC3S250E-4FT256C depends on the specific application, clock frequency, and design implementation. However, the typical power consumption is around 1.5W to 2.5W. You can use the Xilinx Power Estimator tool to get a more accurate estimate.
  • To optimize the XC3S250E-4FT256C for low power consumption, you can use techniques such as clock gating, power gating, and voltage scaling. You can also use the Xilinx Power Optimizer tool to identify areas of high power consumption and optimize your design accordingly.
  • The XC3S250E-4FT256C has 256Kb of block RAM and 12 Kb of distributed RAM. You can also use external memory interfaces such as DDR, DDR2, or DDR3 to access larger amounts of memory.

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XC3S250E-4FT256C Overview

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Image Part Number Model
Part Image XC3S250E-4FT256C AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256

Part Image XC3S250E-4FTG256I AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256

Part Image XC3S250E-4FTG256C AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256

Part Image XC3S250E-4FT256I AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256

Part Image XC3S250E-4FT256IS1 AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256

For a full list of alternate parts for XC3S250E-4FT256C, check out Findchips.com