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XC3S400-4FG456C - AMD

Description: FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA

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XC3S400-4FG456C - AMD PCB footprint - BGA - BGA - FG456
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XC3S400-4FG456C - AMD  - 3D model - BGA - FG456
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XC3S400-4FG456C Details

  • Manufacturer Part Number:

    XC3S400-4FG456C

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    23 X 23 MM, FBGA-456

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    630 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B456

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    896

  • Number of Equivalent Gates:

    400000

  • Number of Inputs:

    264

  • Number of Logic Cells:

    8064

  • Number of Outputs:

    264

  • Number of Terminals:

    456

  • Operating Temperature-Max:

    85 °C

  • Organization:

    896 CLBS, 400000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA456,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC3S400-4FG456C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S400-4FG456C is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S400. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC3S400-4FG456C depends on the specific application and usage. However, Xilinx provides power estimation tools and guidelines to help estimate the power consumption. Typically, the static power consumption is around 1-2W, and the dynamic power consumption depends on the clock frequency and activity.
  • Xilinx provides IP cores and reference designs for high-speed interfaces like PCIe and SATA. These IP cores are optimized for the XC3S400 and provide a pre-verified implementation of the interface. Additionally, Xilinx provides guidelines and documentation on how to configure the FPGA for these interfaces.
  • The maximum bandwidth of the XC3S400's internal memory (Block RAM) is 36.4 Gbps. This is calculated based on the number of Block RAM columns, the clock frequency, and the data width.

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XC3S400-4FG456C Overview

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Part Image XC3S400-4FG456C AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456

Part Image XC3S400-4FG456I AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456

Part Image XC3S400-4FGG456I AMD Xilinx

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456

Part Image XC3S400-4FGG456C AMD

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456

Part Image XC3S400-4FGG456I AMD

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 630MHz, 8064-Cell, CMOS, PBGA456

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