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XC3S50A-4TQ144I - AMD

Description: IC FPGA 108 I/O 144TQFP

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XC3S50A-4TQ144I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQFP144
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XC3S50A-4TQ144I - AMD  - 3D model - Quad Flat Packages - TQFP144
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XC3S50A-4TQ144I Details

  • Manufacturer Part Number:

    XC3S50A-4TQ144I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e4

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    176

  • Number of Equivalent Gates:

    50000

  • Number of Inputs:

    108

  • Number of Logic Cells:

    1584

  • Number of Outputs:

    101

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    176 CLBS, 50000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC3S50A-4TQ144I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC3S50A-4TQ144I is 200 MHz, but it depends on the specific design and implementation.
  • To implement a CDC, use the Xilinx-provided IP cores, such as the Clock Domain Crossing (CDC) IP, or use a synchronizer circuit with a FIFO or a handshake protocol to transfer data between clock domains.
  • The power consumption of the XC3S50A-4TQ144I depends on the specific design, operating frequency, and voltage. However, the typical power consumption is around 1.5W to 2.5W. Use the Xilinx Power Estimator (XPE) tool to get a more accurate estimate.
  • Use the Xilinx ISE Design Suite or Vivado Design Suite to configure the FPGA. These tools provide a graphical interface to design, implement, and program the FPGA. You can also use the Xilinx Software Development Kit (SDK) to develop software applications for the FPGA.
  • The XC3S50A-4TQ144I has 576 Kbits of block RAM and 12 Kbits of distributed RAM. You can also use external memory interfaces, such as DDR2 or DDR3, to increase the memory capacity.

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XC3S50A-4TQ144I Overview

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Part Image XC3S50AN-4TQ144C4100 AMD Xilinx

Field Programmable Gate Array, 667MHz, 1584-Cell, PQFP144

Part Image XC3S50A-4TQG144I AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PQFP144

Part Image XC3S50AN-4TQ144I AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, CMOS, PQFP144

Part Image XC3S50AN-4TQ144I4100 AMD

Field Programmable Gate Array, 667MHz, 1584-Cell, PQFP144

Part Image XC3S50AN-4TQ144C AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, CMOS, PQFP144

For a full list of alternate parts for XC3S50A-4TQ144I, check out Findchips.com