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XC4VLX160-10FF1148C - AMD

Description: Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

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XC4VLX160-10FF1148C - AMD PCB footprint - BGA - BGA - FF1148: Plastic Flip-Chip BGA Package
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XC4VLX160-10FF1148C - AMD  - 3D model - BGA - FF1148: Plastic Flip-Chip BGA Package
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XC4VLX160-10FF1148C Details

  • Manufacturer Part Number:

    XC4VLX160-10FF1148C

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-1148

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    1028 MHz

  • Combinatorial Delay of a CLB-Max:

    0.2 ns

  • JESD-30 Code:

    S-PBGA-B1148

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16896

  • Number of Inputs:

    768

  • Number of Logic Cells:

    152064

  • Number of Outputs:

    768

  • Number of Terminals:

    1148

  • Operating Temperature-Max:

    85 °C

  • Organization:

    16896 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1148,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC4VLX160-10FF1148C Frequently Asked Questions (FAQs)

  • The XC4VLX160-10FF1148C has an industrial temperature range of -40°C to 100°C, and a commercial temperature range of 0°C to 85°C.
  • Use the Xilinx Clocking Wizard tool to generate a clocking scheme that meets your design requirements. Also, consider using a clock buffer (BUFG) to distribute clocks and reduce skew.
  • The XC4VLX160-10FF1148C has 16 high-speed transceivers, each capable of up to 11.18 Gbps data transfer rate, resulting in a maximum aggregate bandwidth of 179 Gbps.
  • Use the Xilinx Power Estimator (XPE) tool to estimate power consumption. Optimize your design by using low-power modes, reducing clock frequencies, and minimizing switching activity.
  • Follow Xilinx's PCB design guidelines, including using a 4-layer PCB, separating analog and digital signals, and using controlled impedance routing for high-speed signals.

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XC4VLX160-10FF1148C Overview

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Part Image XC4VLX160-10FF1148I AMD Xilinx

Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

Part Image XC4VLX160-10FFG1148I AMD

Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

Part Image XC4VLX160-10FF1148I AMD

Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

Part Image XC4VLX160-10FFG1148C AMD Xilinx

Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

Part Image XQ4VLX160-10FF1148I AMD Xilinx

Field Programmable Gate Array, 16896 CLBs, 1028MHz, 152064-Cell, CMOS, PBGA1148

For a full list of alternate parts for XC4VLX160-10FF1148C, check out Findchips.com