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XC5VLX155T-2FF1136C - AMD

Description: series Field Programmable Gate Array (FPGA) IC 640 7815168 155648 1136-BBGA, FCBGA

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XC5VLX155T-2FF1136C - AMD PCB footprint - BGA - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package
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XC5VLX155T-2FF1136C - AMD  - 3D model - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package
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XC5VLX155T-2FF1136C Details

  • Manufacturer Part Number:

    XC5VLX155T-2FF1136C

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1136

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6

  • Combinatorial Delay of a CLB-Max:

    0.77 ns

  • JESD-30 Code:

    S-PBGA-B1136

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    12160

  • Number of Inputs:

    640

  • Number of Logic Cells:

    155648

  • Number of Outputs:

    640

  • Number of Terminals:

    1136

  • Operating Temperature-Max:

    85 °C

  • Organization:

    12160 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1136,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

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XC5VLX155T-2FF1136C Overview

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Part Image XC5VLX155T-2FFG1136I AMD

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Part Image XC5VLX155T-2FFG1136C AMD

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