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XC5VLX50-1FFG1153C - AMD

Description: Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 560 1769472 46080 1153-BBGA, FCBGA

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XC5VLX50-1FFG1153C - AMD PCB footprint - BGA - BGA - FFG1153
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XC5VLX50-1FFG1153C - AMD  - 3D model - BGA - FFG1153
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XC5VLX50-1FFG1153C Details

  • Manufacturer Part Number:

    XC5VLX50-1FFG1153C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1153

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6.1

  • Combinatorial Delay of a CLB-Max:

    0.9 ns

  • JESD-30 Code:

    S-PBGA-B1153

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    3600

  • Number of Inputs:

    560

  • Number of Logic Cells:

    46080

  • Number of Outputs:

    560

  • Number of Terminals:

    1153

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1153,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC5VLX50-1FFG1153C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC5VLX50-1FFG1153C is 550 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • The XC5VLX50-1FFG1153C has 2,376 Kbits of block RAM, 32 Kbits of distributed RAM, and 128 bits of FIFO RAM, for a total of approximately 2.5 Mbits of memory.
  • Yes, the XC5VLX50-1FFG1153C has built-in support for high-speed serial interfaces like PCIe Gen1 and SATA II, with integrated PHYs and dedicated logic for these protocols.
  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite's built-in signal integrity analysis tools, follow best practices for PCB design and layout, and use techniques like shielding, termination, and differential signaling.

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XC5VLX50-1FFG1153C Overview

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Part Image XC5VLX50-1FF1153I AMD

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Part Image XC5VLX50-1FFV1153C AMD

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Part Image XC5VLX50-1FFV1153I AMD

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Part Image XC5VLX50-1FFV1153C AMD Xilinx

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