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XC6SLX100-3CSG484C - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX100-3CSG484C Laminate Chip Scale BGA (CS484/CSG484) Package

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XC6SLX100-3CSG484C - AMD PCB footprint - BGA - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX100-3CSG484C - AMD  - 3D model - BGA - CSG484 - Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC6SLX100-3CSG484C Details

  • Manufacturer Part Number:

    XC6SLX100-3CSG484C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7911

  • Number of Inputs:

    320

  • Number of Logic Cells:

    101261

  • Number of Outputs:

    320

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7911 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XC6SLX100-3CSG484C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX100-3CSG484C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
  • The XC6SLX100-3CSG484C has 37,440 logic cells, 116,480 bits of block RAM, and 4,320 Kbits of distributed RAM. The maximum amount of memory available depends on the specific configuration and usage of these resources.
  • Yes, the XC6SLX100-3CSG484C supports high-speed serial interfaces like PCIe and SATA through its integrated high-speed transceivers, which can operate at speeds up to 6.25 Gbps.
  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential signaling, shielding, and decoupling capacitors.

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XC6SLX100-3CSG484C Overview

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Part Image XC6SLX100-3CSG484I AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA484

Part Image XC6SLX100-3CS484I AMD Xilinx

Field Programmable Gate Array, 862MHz, 101261-Cell, CMOS, PBGA484

Part Image XC6SLX100-3CS484I AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA484