XC6SLX100-3FG676C - AMD

XC6SLX100-3FG676C Details

• Manufacturer Part Number:

  XC6SLX100-3FG676C

• Part Life Cycle Code:

  Active

• Package Description:

  27 X 27 MM, 1 MM PITCH, FBGA-676

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  12 Weeks

• Manufacturer:

  AMD

• YTEOL:

  4

• Clock Frequency-Max:

  862 MHz

• Combinatorial Delay of a CLB-Max:

  0.21 ns

• JESD-30 Code:

  S-PBGA-B676

• JESD-609 Code:

  e0

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  7911

• Number of Inputs:

  480

• Number of Logic Cells:

  101261

• Number of Outputs:

  480

• Number of Terminals:

  676

• Operating Temperature-Max:

  85 °C

• Organization:

  7911 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA676,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  225

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.44 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS, 40 nm

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Lead (Sn63Pb37)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm