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XC6SLX16-3FTG256C - AMD

Description: Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 186 589824 14579 256-LBGA

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XC6SLX16-3FTG256C - AMD PCB footprint - BGA - BGA - FTG256
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XC6SLX16-3FTG256C - AMD  - 3D model - BGA - FTG256
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XC6SLX16-3FTG256C Details

  • Manufacturer Part Number:

    XC6SLX16-3FTG256C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1139

  • Number of Inputs:

    186

  • Number of Logic Cells:

    14579

  • Number of Outputs:

    186

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1139 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC6SLX16-3FTG256C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC6SLX16-3FTG256C is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal to the FPGA.
  • The recommended clocking scheme for XC6SLX16-3FTG256C is to use a single, high-frequency clock source (e.g., 100 MHz) and then use the FPGA's internal clock management resources (e.g., PLLs, clock buffers) to generate the required clock frequencies for the design.
  • To optimize power consumption, use the FPGA's power-saving features, such as clock gating, dynamic voltage and frequency scaling, and power gating. Additionally, optimize the design to minimize switching activity, use low-power IP cores, and consider using a lower-power FPGA speed grade.
  • For optimal signal integrity and power integrity, follow the PCB layout and routing guidelines provided in the FPGA's datasheet and user guide, including using a solid ground plane, minimizing signal trace lengths, and using differential signaling for high-speed signals.

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XC6SLX16-3FTG256C Overview

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Part Image XC6SLX16-3FTG256C AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA256

Part Image XC6SLX16-3FTG256I AMD

Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA256

Part Image XC6SLX16-3FT256C AMD

Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA256

Part Image XC6SLX16-3FTG256I AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA256

Part Image XC6SLX16-3FT256C AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 862MHz, 14579-Cell, CMOS, PBGA256

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