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XC6SLX16-L1CPG196I - AMD

Description: CPG196

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XC6SLX16-L1CPG196I - AMD PCB footprint - BGA - BGA - CPG196 Chip-Scale BGA (0.5 mm Pitch)
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XC6SLX16-L1CPG196I - AMD  - 3D model - BGA - CPG196 Chip-Scale BGA (0.5 mm Pitch)
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XC6SLX16-L1CPG196I Details

  • Manufacturer Part Number:

    XC6SLX16-L1CPG196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    500 MHz

  • Combinatorial Delay of a CLB-Max:

    0.46 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e8

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1139

  • Number of Inputs:

    100

  • Number of Logic Cells:

    14579

  • Number of Outputs:

    100

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1139 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA196,14X14,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

XC6SLX16-L1CPG196I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX16-L1CPG196I is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
  • The -1, -2, and -3 speed grades refer to the device's maximum operating frequency. -1 is the fastest, with a maximum frequency of 350 MHz, while -2 and -3 have lower maximum frequencies. Choose the speed grade based on your design's requirements and power consumption constraints.
  • To ensure signal integrity and reduce noise, use proper PCB design techniques like impedance matching, signal shielding, and decoupling capacitors. Also, use the Xilinx ISE Design Suite's built-in signal integrity analysis tools to identify and mitigate potential issues.
  • The XC6SLX16-L1CPG196I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.

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XC6SLX16-L1CPG196I Overview

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Part Image XC6SLX16-L1CPG196C AMD

Field Programmable Gate Array, 1139 CLBs, 500MHz, 14579-Cell, CMOS, PBGA196

Part Image XC6SLX16-L1CPG196I AMD Xilinx

Field Programmable Gate Array, 1139 CLBs, 14579-Cell, CMOS, PBGA196