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XC6VLX130T-1FFG1156I - AMD

Description: IC FPGA 600 I/O 1156FCBGA

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XC6VLX130T-1FFG1156I - AMD PCB footprint - BGA - BGA - FCBGA-1156
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XC6VLX130T-1FFG1156I - AMD  - 3D model - BGA - FCBGA-1156
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XC6VLX130T-1FFG1156I Details

  • Manufacturer Part Number:

    XC6VLX130T-1FFG1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    35 X 35 MM, LEAD FREE, FBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    8

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    0.36 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    600

  • Number of Logic Cells:

    128000

  • Number of Outputs:

    600

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC6VLX130T-1FFG1156I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6VLX130T-1FFG1156I is 350 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption.
  • The -1 speed grade has a faster maximum clock frequency (350 MHz) compared to the -2 speed grade (250 MHz), but the -2 speed grade has lower power consumption.
  • No, the XC6VLX130T-1FFG1156I is not designed for high-reliability or radiation-hardened applications. For such applications, consider using Xilinx's QPro or RT ProASIC3 FPGAs.
  • Use the Xilinx ISE Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding decoupling capacitors, and minimizing signal routing.

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XC6VLX130T-1FFG1156I Overview

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Part Image XC6VLX130T-1FF1156I AMD

Field Programmable Gate Array, 10000 CLBs, 1098MHz, 128000-Cell, CMOS, PBGA1156

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Part Image XC6VLX130T-1FFG1156I AMD Xilinx

Field Programmable Gate Array, 1098MHz, 128000-Cell, CMOS, PBGA1156

Part Image XC6VLX130T-1FF1156C AMD Xilinx

Field Programmable Gate Array, 1098MHz, 128000-Cell, CMOS, PBGA1156