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XC6VLX240T-2FFG1156C - AMD

Description: FPGA - Field Programmable Gate Array XC6VLX240T-2FFG1156C

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PCB Footprints
XC6VLX240T-2FFG1156C - AMD PCB footprint - BGA - BGA - FFG1156 2021
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XC6VLX240T-2FFG1156C - AMD  - 3D model - BGA - FFG1156 2021
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XC6VLX240T-2FFG1156C Details

  • Manufacturer Part Number:

    XC6VLX240T-2FFG1156C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    35 X 35 MM, LEAD FREE, FBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    8

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.31 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    600

  • Number of Logic Cells:

    241152

  • Number of Outputs:

    600

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    85 °C

  • Organization:

    18840 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC6VLX240T-2FFG1156C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6VLX240T-2FFG1156C is 550 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use Xilinx's Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • The -2 speed grade has a maximum clock frequency of 550 MHz, while the -3 speed grade has a maximum clock frequency of 650 MHz. The -3 speed grade is faster but also consumes more power.
  • Yes, the XC6VLX240T-2FFG1156C is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications. However, you should follow Xilinx's guidelines for designing and testing high-reliability systems.
  • To ensure signal integrity, use Xilinx's ISE Design Suite to analyze and optimize your design for signal integrity, follow best practices for PCB design and layout, and use IBIS models to simulate signal behavior.

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XC6VLX240T-2FFG1156C Overview

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Image Part Number Model
Part Image XC6VLX240T-2FFG1156I AMD

Field Programmable Gate Array, 18840 CLBs, 1286MHz, 241152-Cell, CMOS, PBGA1156

Part Image XC6VLX240T-2FF1156C AMD

Field Programmable Gate Array, 18840 CLBs, 1286MHz, 241152-Cell, CMOS, PBGA1156

Part Image XC6VLX240T-2FF1156I AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA1156

Part Image XC6VLX240T-2FF1156C AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA1156

Part Image XC6VLX240T-2FFG1156C AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA1156

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