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XC6VLX240T-2FFG784C - AMD

Description: IC FPGA 400 I/O 784FCBGA

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XC6VLX240T-2FFG784C - AMD PCB footprint - BGA - BGA - FFG784
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XC6VLX240T-2FFG784C - AMD  - 3D model - BGA - FFG784
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XC6VLX240T-2FFG784C Details

  • Manufacturer Part Number:

    XC6VLX240T-2FFG784C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    29 X 29 MM, LEAD FREE, FBGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    8

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.31 ns

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    4

  • Number of Inputs:

    400

  • Number of Logic Cells:

    241152

  • Number of Outputs:

    400

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    85 °C

  • Organization:

    18840 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA784,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.1 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    29 mm

XC6VLX240T-2FFG784C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6VLX240T-2FFG784C is 550 MHz, but it depends on the specific design and implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption.
  • The XC6VLX240T-2FFG784C has a total of 37,680 Kbits of block RAM, 432 Kbits of distributed RAM, and 128 bits of FIFO RAM.
  • Yes, the XC6VLX240T-2FFG784C is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications.
  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to analyze and optimize your design, and follow best practices for PCB design, such as using differential signaling and shielding.

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XC6VLX240T-2FFG784C Overview

Use the download button to access the XC6VLX240T-2FFG784C schematic symbol, PCB footprint, and 3D model.
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Image Part Number Model
Part Image XC6VLX240T-2FF784I AMD

Field Programmable Gate Array, 18840 CLBs, 1286MHz, 241152-Cell, CMOS, PBGA784

Part Image XC6VLX240T-2FF784C AMD

Field Programmable Gate Array, 18840 CLBs, 1286MHz, 241152-Cell, CMOS, PBGA784

Part Image XC6VLX240T-2FF784C AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA784

Part Image XC6VLX240T-2FF784I AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA784

Part Image XC6VLX240T-2FFG784C AMD Xilinx

Field Programmable Gate Array, 1286MHz, 241152-Cell, CMOS, PBGA784

For a full list of alternate parts for XC6VLX240T-2FFG784C, check out Findchips.com