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XC7A100T-3FTG256E - AMD

Description: FPGA - Field Programmable Gate Array XC7A100T-3FTG256E

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PCB Footprints
XC7A100T-3FTG256E - AMD PCB footprint - BGA - BGA - FT256/FTG256
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XC7A100T-3FTG256E - AMD  - 3D model - BGA - FT256/FTG256
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XC7A100T-3FTG256E Details

  • Manufacturer Part Number:

    XC7A100T-3FTG256E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1412 MHz

  • Combinatorial Delay of a CLB-Max:

    0.94 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7925

  • Number of Inputs:

    170

  • Number of Logic Cells:

    101440

  • Number of Outputs:

    170

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Organization:

    7925 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC7A100T-3FTG256E Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A100T-3FTG256E is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for low power consumption.
  • The -3 speed grade has a higher maximum operating frequency (350 MHz) compared to the -2 speed grade (250 MHz), but both have the same number of logic cells and resources.
  • The XC7A100T-3FTG256E has an industrial temperature range of -40°C to 100°C, but it's recommended to use it within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal routing, add termination resistors, and use differential signaling where necessary.

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XC7A100T-3FTG256E Overview

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