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XC7A200T-2SB484I - AMD

Description: IC FPGA 285 I/O 484FCBGA

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XC7A200T-2SB484I - AMD PCB footprint - BGA - BGA - SBG484
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XC7A200T-2SB484I - AMD  - 3D model - BGA - SBG484
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XC7A200T-2SB484I Details

  • Manufacturer Part Number:

    XC7A200T-2SB484I

  • Part Life Cycle Code:

    Active

  • Package Description:

    19 X 19 MM, 0.80 MM PITCH, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Number of CLBs:

    16825

  • Number of Inputs:

    285

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    285

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

XC7A200T-2SB484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A200T-2SB484I is 500 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies, voltage, and logic utilization. Additionally, consider using low-power modes and dynamic voltage and frequency scaling.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, which provides a pre-verified and optimized design. Follow the Xilinx MIG user guide and implementation guidelines for the XC7A200T-2SB484I.
  • Use the Xilinx Vivado Design Suite to analyze and optimize signal integrity. Implement proper PCB design practices, such as using differential pairs, adding termination resistors, and minimizing signal routing distances. Also, consider using the Xilinx IBERT (Integrated Bit Error Ratio Tester) tool to validate signal integrity.
  • The XC7A200T-2SB484I has limitations on logic resources (e.g., LUTs, FFs, and BRAM), DSP slices, and I/O resources. Carefully plan and optimize resource utilization to avoid over-usage, which can lead to design failures or performance issues.

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XC7A200T-2SB484I Overview

Use the download button to access the XC7A200T-2SB484I schematic symbol, PCB footprint, and 3D model.
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Part Image XC7A200T-2SBG484C AMD

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484

Part Image XC7A200T-2SB484C AMD

Field Programmable Gate Array, PBGA484

Part Image XC7A200T-2SBG484C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, CMOS, PBGA484

Part Image XC7A200T-2SB484C AMD Xilinx

Field Programmable Gate Array, PBGA484

Part Image XC7A200T-2SBV484C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, PBGA484

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