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XC7A200T-L1FBG676I - AMD

Description: FPGA - Field Programmable Gate Array XC7A200T-L1FBG676I

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XC7A200T-L1FBG676I Details

  • Manufacturer Part Number:

    XC7A200T-L1FBG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    400

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7A200T-L1FBG676I Frequently Asked Questions (FAQs)

  • The XC7A200T-L1FBG676I has a commercial temperature range of 0°C to 85°C, and an industrial temperature range of -40°C to 100°C.
  • Xilinx recommends using the MMCM (Mixed-Mode Clock Manager) or PLL (Phase-Locked Loop) to generate stable clock signals. Additionally, using clock domain crossing (CDC) techniques and synchronizers can help ensure reliable clocking.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to analyze and optimize power consumption. Techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling can also help reduce power consumption.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity. Techniques such as using differential signaling, adding termination resistors, and using IBIS models can help improve signal integrity.
  • Xilinx recommends following the PCB layout and routing guidelines outlined in the Xilinx PCB Design Guide. This includes using a multi-layer PCB, following signal routing guidelines, and using decoupling capacitors to reduce noise and improve signal integrity.

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XC7A200T-L1FBG676I Overview

Use the download button to access the XC7A200T-L1FBG676I 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7A2, or try a keyword search, such as Field Programmable Gate Arrays

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