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XC7A25T-2CSG325I - AMD

Description: FPGA - Field Programmable Gate Array XC7A25T-2CSG325I

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XC7A25T-2CSG325I - AMD PCB footprint - BGA - BGA - XC7A25T-2CSG325I
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XC7A25T-2CSG325I Details

  • Manufacturer Part Number:

    XC7A25T-2CSG325I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-325

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA325,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A25T-2CSG325I Frequently Asked Questions (FAQs)

  • The XC7A25T-2CSG325I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • Xilinx recommends using the MMCM (Mixed-Mode Clock Manager) or PLL (Phase-Locked Loop) to generate stable clock signals. Additionally, using clock domain crossing (CDC) techniques can help ensure reliable data transfer between clock domains.
  • The maximum power consumption of the XC7A25T-2CSG325I is approximately 2.5W, depending on the device utilization, clock frequency, and operating conditions.
  • To optimize power consumption, use techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, using Xilinx's Power Analyzer tool can help identify areas of high power consumption and provide optimization suggestions.
  • The XC7A25T-2CSG325I has high-speed transceivers that support up to 12.5 Gbps data transfer rates, making it suitable for high-bandwidth applications such as PCIe, SATA, and Ethernet.

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XC7A25T-2CSG325I Overview

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Part Image XC7A25T-2CSG325C AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1286MHz, 23360-Cell, HKMG, PBGA325