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XC7A35T-1CSG325I - AMD

Description: FPGA - Field Programmable Gate Array XC7A35T-1CSG325I

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PCB Footprints
XC7A35T-1CSG325I - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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3D Models
XC7A35T-1CSG325I - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7A35T-1CSG325I Details

  • Manufacturer Part Number:

    XC7A35T-1CSG325I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-325

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2600

  • Number of Inputs:

    150

  • Number of Logic Cells:

    33280

  • Number of Outputs:

    150

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA325,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A35T-1CSG325I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A35T-1CSG325I is 500 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates the necessary IP cores and interface logic.
  • The power consumption of the XC7A35T-1CSG325I depends on the specific application, clock frequency, and design implementation. However, the typical power consumption is around 1-2 Watts.
  • Yes, the XC7A35T-1CSG325I has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and others, with data rates up to 12.5 Gbps.
  • Xilinx provides various security features, such as bitstream encryption, secure boot, and anti-tamper features, to secure your design on the XC7A35T-1CSG325I.

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XC7A35T-1CSG325I Overview

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Part Image XC7A35T-1CSG325C AMD

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325

Part Image XC7A35T-1CSG325C AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325

Part Image XC7A35T-1CSG325I AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325