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XC7A35T-1CSG325C - AMD

Description: IC FPGA 150 I/O 324CSBGA

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PCB Footprints
XC7A35T-1CSG325C - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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3D Models
XC7A35T-1CSG325C - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7A35T-1CSG325C Details

  • Manufacturer Part Number:

    XC7A35T-1CSG325C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-325

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B325

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2600

  • Number of Inputs:

    150

  • Number of Logic Cells:

    33280

  • Number of Outputs:

    150

  • Number of Terminals:

    325

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA325,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A35T-1CSG325C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A35T-1CSG325C is 500 MHz, but it depends on the specific application and clock domain.
  • You can implement a DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates a customized IP core for the FPGA.
  • The power consumption of the XC7A35T-1CSG325C depends on the specific application, clock frequency, and operating conditions. However, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W.
  • Yes, the XC7A35T-1CSG325C has built-in transceivers that support high-speed serial interfaces like PCIe Gen2, SATA, and others, with data rates up to 6.25 Gbps.
  • Xilinx provides a range of security features, including bitstream encryption, authentication, and secure boot mechanisms. You can also use third-party IP cores and tools to enhance the security of your design.

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XC7A35T-1CSG325C Overview

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Image Part Number Model
Part Image XC7A35T-1CSG325I AMD

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325

Part Image XC7A35T-1CSG325C AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325

Part Image XC7A35T-1CSG325I AMD Xilinx

Field Programmable Gate Array, 2600 CLBs, 1098MHz, 33280-Cell, PBGA325