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XC7A35T-3FGG484E - AMD

Description: FPGA - Field Programmable Gate Array XC7A35T-3FGG484E

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PCB Footprints
XC7A35T-3FGG484E - AMD PCB footprint - BGA - BGA - FGG484_2020
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3D Models
XC7A35T-3FGG484E - AMD  - 3D model - BGA - FGG484_2020
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XC7A35T-3FGG484E Details

  • Manufacturer Part Number:

    XC7A35T-3FGG484E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1412 MHz

  • Combinatorial Delay of a CLB-Max:

    0.94 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2600

  • Number of Inputs:

    250

  • Number of Logic Cells:

    33280

  • Number of Outputs:

    250

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Organization:

    2600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC7A35T-3FGG484E Frequently Asked Questions (FAQs)

  • Xilinx provides a PCB design guide and layout recommendations in the '7 Series FPGAs PCB Design Guide' document (UG483). It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • Xilinx provides power estimation and thermal management guidelines in the '7 Series FPGAs Power Management' document (UG474). Engineers can use the Xilinx Power Estimator (XPE) tool to estimate power consumption and optimize their design accordingly.
  • Xilinx provides clocking and synchronization guidelines in the '7 Series FPGAs Clocking Resources' document (UG472). Engineers should use the Clocking Wizard tool in Vivado Design Suite to generate clocking architectures and ensure proper synchronization.
  • Xilinx provides a Secure Boot and Encryption solution through the '7 Series FPGAs and Zynq-7000 SoC Secure Boot' document (UG470). Engineers can use the Vivado Design Suite and the Xilinx Secure Boot and Encryption tools to implement secure boot and encryption mechanisms.
  • Xilinx provides detailed documentation on the FPGA's peripherals in the '7 Series FPGAs Peripheral Manual' document (UG471). Engineers should carefully review the documentation to understand the limitations and considerations for using these peripherals, such as PCIe and DDR3 interface configuration, timing, and signal integrity.

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XC7A35T-3FGG484E Overview

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