- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for XC7K325T-1FB900I
- Part Number XC7K325T-1FB900I
- Manufacturer AMD
- Pin Count 900
- Part Category Hardware
- Package Category BGA
- Footprint Name BGA - FB900, FBG900, and FBV900 (Kintex-7 FPGAs) Flip-Chip Lidless BGA (1.0 mm Pitch)
- Released Date Apr 12, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XC7K325T-1FB900I Details
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Manufacturer Part Number:
XC7K325T-1FB900I
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Part Life Cycle Code:
Active
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Package Description:
FBGA-900
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HTS Code:
8542.31.00.60
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
14
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Clock Frequency-Max:
1818 MHz
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Combinatorial Delay of a CLB-Max:
0.3 ns
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JESD-30 Code:
S-PBGA-B900
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JESD-609 Code:
e0
XC7K325T-1FB900I Frequently Asked Questions (FAQs)
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Xilinx provides a PCB design guide and layout recommendations in the '7 Series FPGAs PCB Design Guide' document (UG483). It's essential to follow these guidelines to ensure signal integrity, reduce noise, and meet thermal requirements.
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To minimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, ensure proper thermal management by using heat sinks, thermal interfaces, and airflow management.
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Use the Xilinx Vivado Design Suite to design, implement, and program the FPGA. Follow the 'Vivado Design Suite Tutorial' and '7 Series FPGAs Configuration' documentation to ensure correct configuration and programming. Implement a robust configuration strategy, such as using a configuration flash, and ensure that the FPGA is properly reset during configuration.
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Follow the Xilinx '7 Series FPGAs PCB Design Guide' and 'Signal Integrity' documentation to ensure signal integrity. Implement proper signal termination, use differential signaling, and add decoupling capacitors to reduce EMI. Additionally, use shielding and grounding techniques to minimize radiation and conducted emissions.
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The XC7K325T-1FB900I FPGA has built-in reliability and fault tolerance features such as error correction codes, checksums, and redundant logic. Implement Xilinx's 'Soft Error Mitigation' techniques to detect and correct single-event upsets. Additionally, use redundant designs and voting logic to ensure fault tolerance in critical systems.
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XC7K325T-1FB900I Overview
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