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XC7K410T-1FFG676C - AMD

Description: IC FPGA 400 I/O 676FCBGA

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XC7K410T-1FFG676C - AMD - PCB symbol
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XC7K410T-1FFG676C - AMD PCB footprint - BGA - BGA - FGG676
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XC7K410T-1FFG676C - AMD - 3D model - BGA - FGG676
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XC7K410T-1FFG676C Details

  • Manufacturer Part Number:

    XC7K410T-1FFG676C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    0.3 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    31775

  • Number of Inputs:

    400

  • Number of Logic Cells:

    406720

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    85 °C

  • Organization:

    31775 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.37 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7K410T-1FFG676C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K410T-1FFG676C is 500 MHz, but it depends on the specific application, clocking scheme, and device utilization.
  • You can implement a DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates a customized IP core for the FPGA. You'll need to specify the memory type, speed, and other parameters to generate the IP core.
  • The power consumption of the XC7K410T-1FFG676C depends on the specific application, clock frequency, and device utilization. However, according to the datasheet, the typical static power consumption is around 2.5W, and the dynamic power consumption can range from 5W to 15W or more, depending on the design.
  • Yes, the XC7K410T-1FFG676C is capable of supporting high-speed serial interfaces like PCIe and SATA. It has built-in transceivers that can operate at speeds up to 12.5 Gbps, making it suitable for high-speed applications.
  • You can use Xilinx's Vivado Design Suite, which provides a comprehensive development environment for designing, simulating, and debugging your FPGA design. You can also use the ChipScope Pro tool for on-chip debugging and verification.

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XC7K410T-1FFG676C Overview

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XC7K410T-1FFG676C Alternates

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Image Part Number Model
Part Image XC7K410T-1FFG676I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, 1098MHz, 406720-Cell, CMOS, PBGA676
Part Image XC7K410T-1FF676I AMD Xilinx

Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA676
Part Image XC7K410T-1FF676C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA676
Part Image XC7K410T-1FFV676C AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, PBGA676
Part Image XC7K410T-1FFV676I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, PBGA676
For a full list of alternate parts for XC7K410T-1FFG676C, check out Findchips.com