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XC7S100-L1FGGA484I - AMD

Description: FPGA - Field Programmable Gate Array XC7S100-L1FGGA484I

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XC7S100-L1FGGA484I - AMD - PCB symbol
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PCB Footprints
XC7S100-L1FGGA484I - AMD PCB footprint - BGA - BGA - FGGA484
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XC7S100-L1FGGA484I - AMD - 3D model - BGA - FGGA484
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XC7S100-L1FGGA484I Details

  • Manufacturer Part Number:

    XC7S100-L1FGGA484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of CLBs:

    8000

  • Number of Inputs:

    400

  • Number of Logic Cells:

    102400

  • Number of Outputs:

    400

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XC7S100-L1FGGA484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC7S100-L1FGGA484I is 350 MHz.
  • You can implement DDR3 memory interface on XC7S100-L1FGGA484I using the MIG (Memory Interface Generator) IP core provided by Xilinx. The MIG IP core provides a pre-verified and optimized DDR3 memory interface solution.
  • Yes, XC7S100-L1FGGA484I is suitable for high-reliability applications. It is fabricated using a 28nm process and has undergone rigorous testing and qualification to ensure its reliability and performance.
  • You can optimize power consumption on XC7S100-L1FGGA484I by using power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, you can use Xilinx's Power Estimator tool to estimate and optimize power consumption.
  • Yes, XC7S100-L1FGGA484I is fully compatible with Xilinx's Vivado design environment. Vivado provides a comprehensive development environment for designing, implementing, and verifying digital systems on XC7S100-L1FGGA484I.

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XC7S100-L1FGGA484I Overview

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