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XC7S15-2FTGB196I - AMD

Description: XILINX - XC7S15-2FTGB196I - FPGA, Spartan-7, 2000 Blocks, 12800 Macrocells, 360Kbit RAM, 950mV to 1.05V Core Supply, CSBGA-196

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XC7S15-2FTGB196I - AMD PCB footprint - BGA - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S15-2FTGB196I - AMD  - 3D model - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S15-2FTGB196I Details

  • Manufacturer Part Number:

    XC7S15-2FTGB196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    1000

  • Number of Inputs:

    100

  • Number of Logic Cells:

    12800

  • Number of Outputs:

    100

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S15-2FTGB196I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S15-2FTGB196I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • You can implement a reliable POR by using an external reset circuit or by using the internal POR circuitry. The internal POR circuitry is enabled by default, but it can be disabled by programming the FPGA. It's recommended to use an external reset circuit for more reliable operation.
  • The recommended clocking scheme for XC7S15-2FTGB196I is to use a single clock domain for the entire design. However, if multiple clock domains are required, it's recommended to use a clock domain crossing (CDC) circuit to ensure reliable data transfer between domains.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling can be used to reduce power consumption.
  • The maximum current rating for the I/O pins of XC7S15-2FTGB196I is 25mA per pin. However, the total current drawn from the I/O banks should not exceed the maximum current rating specified in the datasheet.

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XC7S15-2FTGB196I Overview

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Part Image XC7S15-2FTGB196C AMD

Field Programmable Gate Array, 1286MHz, 12800-Cell, PBGA196