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XC7S25-1CSGA324C - AMD

Description: XC7S25-1CSGA324C

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XC7S25-1CSGA324C - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-1CSGA324C - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-1CSGA324C Details

  • Manufacturer Part Number:

    XC7S25-1CSGA324C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S25-1CSGA324C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S25-1CSGA324C is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC7S25. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC7S25-1CSGA324C depends on the specific design and usage. However, Xilinx provides power estimation tools and guidelines to help estimate the power consumption. Typically, the static power consumption is around 1-2W, and the dynamic power consumption depends on the clock frequency and activity.
  • Xilinx provides IP cores and reference designs for high-speed interfaces like PCIe and Ethernet. These IP cores are optimized for the XC7S25 and provide a starting point for implementing these interfaces. Additionally, Xilinx provides documentation and guidelines for configuring the FPGA for high-speed interfaces.
  • The maximum bandwidth of the XC7S25's internal memory (Block RAM) is 12.8 GB/s. This is calculated based on the memory size, clock frequency, and access width.

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XC7S25-1CSGA324C Overview

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Part Image XC7S25-1CSGA324I AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1098MHz, 23360-Cell, PBGA324

Part Image XC7S25-1CSGA324C AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1098MHz, 23360-Cell, PBGA324

Part Image XC7S25-1CSGA324Q AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1098MHz, 23360-Cell, PBGA324