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XC7S25-1CSGA324I - AMD

Description: XILINX - XC7S25-1CSGA324I - FPGA, Spartan-7, 3650 Blocks, 23360 Macrocells, 1620Kbit RAM, 950mV to 1.05V Core Supply, CSBGA-324

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PCB Footprints
XC7S25-1CSGA324I - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-1CSGA324I - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-1CSGA324I Details

  • Manufacturer Part Number:

    XC7S25-1CSGA324I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S25-1CSGA324I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S25-1CSGA324I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) guide that explains how to implement CDC in their FPGAs, including the XC7S25. The guide covers CDC techniques, such as synchronizers, FIFOs, and handshake signals.
  • The power consumption of XC7S25-1CSGA324I depends on the specific design and operating conditions. However, Xilinx provides power estimation tools, such as Xilinx Power Estimator (XPE), to help estimate the power consumption of their FPGAs.
  • Yes, the XC7S25-1CSGA324I is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems. Xilinx provides a range of features and tools to support high-reliability design, including SEU mitigation, error correction, and fault tolerance.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, ILA (Integrated Logic Analyzer), and VIO (Virtual Input/Output). These tools allow you to debug and test your design at various stages of development.

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XC7S25-1CSGA324I Overview

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Part Image XC7S25-1CSGA324I AMD Xilinx

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