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XC7S25-2CSGA324C - AMD

Description: IC FPGA 150 I/O 324CSGA

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XC7S25-2CSGA324C - AMD PCB footprint - BGA - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-2CSGA324C - AMD  - 3D model - BGA - 324 Ball Chip-Scale BGA (CSG324) Package,
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XC7S25-2CSGA324C Details

  • Manufacturer Part Number:

    XC7S25-2CSGA324C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S25-2CSGA324C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S25-2CSGA324C is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC7S25. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC7S25-2CSGA324C depends on the specific design and usage. However, Xilinx provides power estimation tools and guidelines to help estimate power consumption. Typically, the static power consumption is around 1-2W, and dynamic power consumption depends on the clock frequency and design activity.
  • Xilinx provides IP cores and reference designs for high-speed interfaces like PCIe and Ethernet. These IP cores are optimized for the specific FPGA family and provide a pre-verified and validated solution. Additionally, Xilinx provides documentation and user guides on how to configure and implement these interfaces.
  • The maximum bandwidth of the internal memory (Block RAM) in XC7S25-2CSGA324C is 12.8 GB/s. This is calculated based on the memory size, clock frequency, and access width.

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XC7S25-2CSGA324C Overview

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Part Image XC7S25-2CSGA324I AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1286MHz, 23360-Cell, PBGA324