Part Image

XC7S50-L1FGGA484I - AMD

Description: FPGA - Field Programmable Gate Array XC7S50-L1FGGA484I

Download XC7S50-L1FGGA484I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XC7S50-L1FGGA484I - AMD PCB footprint - BGA - BGA - FGGA484
click to zoom
3D Models
XC7S50-L1FGGA484I - AMD  - 3D model - BGA - FGGA484
click to zoom

XC7S50-L1FGGA484I Details

  • Manufacturer Part Number:

    XC7S50-L1FGGA484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XC7S50-L1FGGA484I Frequently Asked Questions (FAQs)

  • The XC7S50-L1FGGA484I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • The XC7S50-L1FGGA484I has a built-in Memory Interface Generator (MIG) that supports DDR3 memory interfaces. You can use the MIG tool in Vivado Design Suite to generate the necessary IP cores and interface logic.
  • Yes, the XC7S50-L1FGGA484I has high-speed transceivers that support PCIe Gen2 and SATA II interfaces, making it suitable for high-speed serial applications.
  • Xilinx provides power estimation and optimization tools in Vivado Design Suite, such as the Power Analyzer and the Power Optimization Guide. You can also use techniques like clock gating, voltage scaling, and dynamic voltage and frequency scaling to reduce power consumption.
  • The XC7S50-L1FGGA484I has a maximum clock frequency of 500 MHz, making it suitable for high-performance applications.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XC7S50-L1FGGA484I Overview

Use the download button to access the XC7S50-L1FGGA484I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7S5, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to XC7S50-L1FGGA484I

Showing 0 results