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XC7VX690T-2FFG1158I - AMD

Description: IC FPGA 350 I/O 1158FCBGA

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XC7VX690T-2FFG1158I - AMD PCB footprint - BGA - BGA - FFG1156_2021
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XC7VX690T-2FFG1158I - AMD  - 3D model - BGA - FFG1156_2021
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XC7VX690T-2FFG1158I Details

  • Manufacturer Part Number:

    XC7VX690T-2FFG1158I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1158

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B1158

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    54150

  • Number of Inputs:

    350

  • Number of Logic Cells:

    693120

  • Number of Outputs:

    350

  • Number of Terminals:

    1158

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    54150 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7VX690T-2FFG1158I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7VX690T-2FFG1158I is 500 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, which provides a pre-verified and optimized design. Additionally, follow the Xilinx DDR3 memory interface implementation guidelines and ensure proper signal integrity and timing closure.
  • Use the Xilinx Vivado Design Suite to analyze and optimize signal integrity. Implement proper PCB design practices, such as using differential pairs, adding decoupling capacitors, and minimizing signal routing lengths. Additionally, use the FPGA's built-in features, such as signal conditioning and termination, to reduce noise and improve signal quality.
  • Follow the Xilinx PCB design guidelines and recommendations for the XC7VX690T-2FFG1158I. Use a 4-6 layer PCB stackup with a dedicated power plane, and ensure proper signal routing, decoupling, and thermal management. Consult the Xilinx documentation and application notes for specific guidance.

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XC7VX690T-2FFG1158I Overview

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Part Image XC7VX690T-2FF1158I AMD

Field Programmable Gate Array, 54150 CLBs, 1818MHz, 693120-Cell, CMOS, PBGA1158

Part Image XC7VX690T-2FF1158I AMD Xilinx

Field Programmable Gate Array, 1818MHz, 693120-Cell, CMOS, PBGA1156

Part Image XC7VX690T-2FFG1158C AMD Xilinx

Field Programmable Gate Array, 54150 CLBs, 1818MHz, 693120-Cell, CMOS, PBGA1158

Part Image XC7VX690T-2FFG1158E AMD Xilinx

Field Programmable Gate Array

Part Image XC7VX690T-2FFG1158E AMD

Field Programmable Gate Array

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