XC7Z030-1FBG676C - AMD

XC7Z030-1FBG676C Details

• Manufacturer Part Number:

  XC7Z030-1FBG676C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-676

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• YTEOL:

  14

• Combinatorial Delay of a CLB-Max:

  1.27 ns

• JESD-30 Code:

  S-PBGA-B676

• Length:

  27 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  9825

• Number of Inputs:

  378

• Number of Logic Cells:

  125000

• Number of Outputs:

  378

• Number of Terminals:

  676

• Operating Temperature-Max:

  85 °C

• Organization:

  9825 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA676,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  250

• Programmable Logic Type:

  FPGA SOC

• Seated Height-Max:

  2.54 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  28 nm

• Terminal Finish:

  Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm