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XC7Z035-2FBG676I - AMD

Description: XILINX - XC7Z035-2FBG676I - PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676

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PCB Footprints
XC7Z035-2FBG676I - AMD PCB footprint - BGA - BGA - FB676, FBG676, and FBV676 (Artix-7 FPGAs) Flip-Chip Lidless BGA (1.0 mm Pitch
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3D Models
XC7Z035-2FBG676I - AMD  - 3D model - BGA - FB676, FBG676, and FBV676 (Artix-7 FPGAs) Flip-Chip Lidless BGA (1.0 mm Pitch
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XC7Z035-2FBG676I Details

  • Manufacturer Part Number:

    XC7Z035-2FBG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • JESD-30 Code:

    S-PBGA-B676

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    21487

  • Number of Inputs:

    378

  • Number of Logic Cells:

    275000

  • Number of Outputs:

    378

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    21487 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7Z035-2FBG676I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7Z035-2FBG676I is 300 MHz, but it depends on the specific application and design implementation.
  • The XC7Z035-2FBG676I has a built-in DDR3 memory controller, and you can use the Xilinx MIG (Memory Interface Generator) tool to generate the necessary IP cores and implement the DDR3 interface.
  • Yes, the XC7Z035-2FBG676I has built-in transceivers that support high-speed serial interfaces like PCIe Gen2 and SATA II, with data rates up to 5 Gbps.
  • The power consumption of the XC7Z035-2FBG676I depends on the specific application and design implementation, but the typical static power consumption is around 1.5W, and the dynamic power consumption can range from 2W to 10W or more, depending on the clock frequency and activity.
  • You can use the Xilinx Vivado Design Suite to design, implement, and debug your FPGA design. The Vivado suite provides a comprehensive development environment, including a simulator, synthesizer, and implementation tools.

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XC7Z035-2FBG676I Overview

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Part Image XC7Z035-2FBG676I AMD Xilinx

FPGA SOC, 21487 CLBS, 275000-Cell, PBGA676