XC7Z035-L2FFG900I - AMD

XC7Z035-L2FFG900I Details

• Manufacturer Part Number:

  XC7Z035-L2FFG900I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-900

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• YTEOL:

  14

• JESD-30 Code:

  S-PBGA-B900

• Length:

  31 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  21487

• Number of Inputs:

  128

• Number of Logic Cells:

  275000

• Number of Outputs:

  128

• Number of Terminals:

  900

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  21487 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA900,30X30,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Packing Method:

  TRAY

• Peak Reflow Temperature (Cel):

  245

• Programmable Logic Type:

  FPGA SOC

• Seated Height-Max:

  3.35 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  28 nm

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  31 mm