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XC7Z045-2FBG676I - AMD

Description: XILINX - XC7Z045-2FBG676I - PSOC, ARM CORTEX-A9, 800MHZ, FCBGA-676

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PCB Footprints
XC7Z045-2FBG676I - AMD PCB footprint - BGA - BGA - FBG676
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XC7Z045-2FBG676I - AMD  - 3D model - BGA - FBG676
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XC7Z045-2FBG676I Details

  • Manufacturer Part Number:

    XC7Z045-2FBG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B676

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    27325

  • Number of Inputs:

    378

  • Number of Logic Cells:

    350000

  • Number of Outputs:

    378

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    27325 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FPGA SOC

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7Z045-2FBG676I Frequently Asked Questions (FAQs)

  • The maximum power consumption of XC7Z045-2FBG676I is approximately 12W, but it can vary depending on the design and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies and voltage. Additionally, use low-power modes, reduce switching activity, and optimize the design for low power.
  • The maximum operating frequency of XC7Z045-2FBG676I is 500 MHz, but it can vary depending on the design and operating conditions.
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity, use differential signaling, and add termination resistors as needed. Additionally, follow Xilinx's guidelines for signal integrity and PCB design.
  • The maximum temperature range for XC7Z045-2FBG676I is -40°C to 100°C, but it can vary depending on the specific application and operating conditions.

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XC7Z045-2FBG676I Overview

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