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XC8107AC15ER-G - Torex

Description: Power Switch ICs - Power Distribution 85m High Function Power Switch (Fixed Current Limit)

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XC8107AC15ER-G Details

  • Manufacturer Part Number:

    XC8107AC15ER-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    USP-6

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Torex Semiconductor LTD

  • YTEOL:

    10

  • Additional Feature:

    CURRENT LIMIT:2.09A; THERMAL SHUTDOWN:150C; ADJUSTABLE CURRENT LIMIT

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-N6

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.07,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Silver/Gold (Ni/Ag/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    1.9

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    1.8 mm

XC8107AC15ER-G Frequently Asked Questions (FAQs)

  • Torex recommends a compact PCB layout with minimal trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Additionally, place decoupling capacitors close to the IC and use a common ground point for all components.
  • Ensure good thermal design and heat dissipation by providing adequate airflow, using a heat sink if necessary, and keeping the device away from heat sources. Monitor the junction temperature (Tj) and adjust the operating conditions accordingly to prevent overheating.
  • Torex recommends using ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.
  • Yes, but ensure the device is properly secured to the PCB using a suitable mounting method, such as soldering or using a vibration-resistant connector. Additionally, consider using a vibration-dampening material or a shock-absorbing mounting system to reduce the impact of vibrations on the device.
  • Start by verifying the power supply voltage, input/output voltage levels, and signal integrity. Check for proper PCB layout, decoupling, and ESD protection. Use oscilloscopes or logic analyzers to debug signal waveforms and timing. Consult the datasheet and application notes for specific troubleshooting guidelines.

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XC8107AC15ER-G Overview

Use the download button to access the XC8107AC15ER-G 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC810, or try a keyword search, such as Power Management Circuits

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