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XCAU10P-1SBVB484E - AMD

Description: Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 3670016 96250 484-BFBGA, FCBGA

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XCAU10P-1SBVB484E - AMD PCB footprint - BGA - BGA - SBVB484
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XCAU10P-1SBVB484E - AMD  - 3D model - BGA - SBVB484
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XCAU10P-1SBVB484E Details

  • Manufacturer Part Number:

    XCAU10P-1SBVB484E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5500

  • Number of Inputs:

    204

  • Number of Logic Cells:

    96250

  • Number of Outputs:

    204

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Organization:

    5500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XCAU10P-1SBVB484E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCAU10P-1SBVB484E is -40°C to 100°C.
  • The XCAU10P-1SBVB484E has a built-in power management system. You can use the Power Management Interface (PMI) to control power modes, voltage, and frequency scaling. Refer to the datasheet and AMD's power management documentation for implementation details.
  • AMD provides a reference design guide and PCB layout recommendations in the datasheet and application notes. Key considerations include signal integrity, power delivery, and thermal management. It's essential to follow AMD's guidelines to ensure optimal performance and reliability.
  • To optimize the XCAU10P-1SBVB484E for low power consumption, use the power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimize your software and firmware to minimize power consumption, and consider using low-power modes during idle periods.
  • AMD provides a range of development tools and software, including the AMD Software Development Kit (SDK), AMD Embedded Linux, and AMD's proprietary development environment. Additionally, third-party tools and software, such as IAR Embedded Workbench and Keil µVision, are also available.

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XCAU10P-1SBVB484E Overview

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Part Image XCAU10P-1SBVB484E AMD Xilinx

Field Programmable Gate Array, 5500 CLBS, 96250-Cell, PBGA484