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XCAU10P-2FFVB676E - AMD

Description: Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 228 3670016 96250 676-BBGA, FCBGA

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XCAU10P-2FFVB676E - AMD PCB footprint - BGA - BGA - FFVB676
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XCAU10P-2FFVB676E - AMD  - 3D model - BGA - FFVB676
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XCAU10P-2FFVB676E Details

  • Manufacturer Part Number:

    XCAU10P-2FFVB676E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B676

  • Length:

    27 mm

  • Number of CLBs:

    5500

  • Number of Inputs:

    228

  • Number of Logic Cells:

    96250

  • Number of Outputs:

    228

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Organization:

    5500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

XCAU10P-2FFVB676E Frequently Asked Questions (FAQs)

  • AMD provides a reference design guide for the Xilinx Zynq UltraScale+ MPSoC family, which includes the XCAU10P-2FFVB676E. The guide covers PCB layout, thermal design, and power delivery recommendations. Additionally, AMD offers a thermal modeling tool to help designers optimize their thermal design.
  • The XCAU10P-2FFVB676E supports secure boot through the use of encrypted boot images and secure key storage. AMD provides a Secure Boot and Anti-Tamper (SBAT) tool to help designers implement secure boot mechanisms. Additionally, the device supports various security protocols, such as AES and SHA, to ensure the integrity of firmware and data.
  • While the datasheet provides some power consumption and thermal characteristics, AMD also offers a Power Estimation Tool (PET) to help designers estimate power consumption based on their specific use case and operating conditions. Additionally, AMD provides thermal simulation models and thermal design guidelines to help designers optimize their thermal design.
  • AMD provides a range of optimization tools and guides, including the Xilinx Zynq UltraScale+ MPSoC Optimization Guide, which covers topics such as clocking, memory optimization, and power management. Additionally, AMD offers a range of development boards and software development kits (SDKs) to help designers optimize their design for their specific application.
  • AMD offers a range of development tools and software frameworks, including the Xilinx Vivado Design Suite, the Xilinx Software Development Kit (SDK), and the Xilinx Runtime (XRT). These tools provide a comprehensive development environment for designing, developing, and debugging applications on the XCAU10P-2FFVB676E.

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XCAU10P-2FFVB676E Overview

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