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XCAU10P-L1SBVB484I - AMD

Description: FPGA - Field Programmable Gate Array XCAU10P-L1SBVB484I

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PCB Footprints
XCAU10P-L1SBVB484I - AMD PCB footprint - BGA - BGA - SBVB484
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XCAU10P-L1SBVB484I - AMD  - 3D model - BGA - SBVB484
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XCAU10P-L1SBVB484I Details

  • Manufacturer Part Number:

    XCAU10P-L1SBVB484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • Additional Feature:

    ALSO OPERATES AT 0.85V NOMINAL SUPPLY

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5500

  • Number of Inputs:

    204

  • Number of Logic Cells:

    96250

  • Number of Outputs:

    204

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5500 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max:

    0.742 V

  • Supply Voltage-Min:

    0.698 V

  • Supply Voltage-Nom:

    0.72 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XCAU10P-L1SBVB484I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XCAU10P-L1SBVB484I is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • To optimize power consumption, ensure that the device is operated within the recommended voltage range (1.0V to 1.2V) and that the clock frequency is set to the lowest required value for your application. Additionally, consider using power-saving features like clock gating, dynamic voltage and frequency scaling, and shutdown modes when not in use.
  • For optimal performance and signal integrity, follow the recommended PCB layout guidelines in the datasheet, including using a 4-layer PCB, placing decoupling capacitors close to the device, and minimizing signal trace lengths and impedance mismatches. Additionally, consider using a solid ground plane and avoiding vias under the device.
  • To troubleshoot common issues, start by verifying the power supply and clock signals, ensuring that they meet the recommended specifications. Check the device's configuration and reset signals, and verify that the boot mode is correctly set. If issues persist, consult the datasheet and application notes for specific troubleshooting guidelines and consider using debugging tools like JTAG or serial console output.
  • To prevent damage and ensure reliability, store the XCAU10P-L1SBVB484I in a dry, cool environment (less than 30°C and 60% relative humidity) away from direct sunlight and moisture. Handle the device by the edges, avoiding touching the pins or electrical contacts, and use anti-static packaging and handling materials to prevent electrostatic discharge (ESD) damage.

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XCAU10P-L1SBVB484I Overview

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Part Image XCAU10P-L1SBVB484I AMD Xilinx

Field Programmable Gate Array, 5500 CLBS, 96250-Cell, PBGA484